AD-MIO-5355
Qualcomm QCS6490/QSC5430 on 3.5" SBC, OS support Windows on Arm & Ubuntu.
- Qualcomm® QCS6490/QCS5430 on 3.5" SBC, support extend operating temperature -20~70°C
- Powerful but Low Power with 8x Kryo 670 CPU from 1.9 up to 2.7 GHz + Adreno GPU 643 + up to 12.3 TOPs iNPU
- Rugged Design with On-board 8GB LPDDR5 and 128GB UFS or eMMC
- Flexible Displays with HDMI and LVDS or Opt. eDP & Rich I/Os: 2x GbE, 6x USB, 4x COM, 2x MIPI-CSI, 1x Audio
- 3x M.2 Expansions: M.2 E-Key 2230 for WiFi/BT, M.2 B-Key 3052 for 4G/LTE, M.2 B-Key 2280 for NVMe Storage
- Various OS Support: Windows on Arm and Ubuntu
Datasheet
| Model | MIO-5355Q6Z-U7A1U |
|---|---|
| Processor | |
| CPU | Qualcomm Dragonwing™ QCS6490 |
| Max Turbo Frequency | 2.7GHz |
| Core Number | 8 |
| Memory | |
| Technology | LPDDR5 |
| Max. Capacity | up to 8 GB |
| Storage | |
| UFS | Up to 128GB |
| eMMC | Up to 128GB |
| Graphics | |
| GPU | Adreno™ 643 |
| Max. Frequency | 1.25 GHz |
| AI Engine | |
| NPU | Hexagon™ 770 |
| Clock Speed | 1.45 GHz |
| Display | |
| LCD | LVDS: Dual channel 18/24-bit, up to 1920 x 1080 |
| HDMI | 1 x HDMI2.0, up to 4096 x 2160 |
| Dual Display | HDMI+LVDS |
| Ethernet | |
| Controller | LAN1/LAN2: RTL8211FS |
| Speed | 10/100/1000 Mbps |
| Rear I/O | |
| Ethernet | 2 |
| HDMI | 1 |
| USB 3.0 | 2 |
| Audio | 1 (Line-Out, Mic-In) |
| USB 2.0 | 2 |
| Internal I/O | |
| USB | 2 x USB3.0 |
| Serial | COM1/2 RS232/422/485, COM3/4 RS232 with auto flow control (ESD protection: air gap ±15kV, contact ±8kV) |
| GPIO | 8-bit general purpose input/output |
| I2C | 2 |
| Front Panel Control | Power-on, Reset, Power LED |
| Inverter | 1 |
| Expansion | |
| M.2 E-Key | 1 x E-Key 2230 |
| M.2 B-Key | 1 x B-Key 2280, 1 x B-Key 3052 with Nano-SIM |
| Power | |
| Power Supply Voltage | 12V ± 10% |
| Connector | ATX 2x2p |
| Power Management | AT, ATX |
| Environment | |
| Operating Temperature | Standard: 0 ~ 60 °C (32 ~ 140 °F) ; Extend: -20~70 °C (-4~158 °F) with 0.7m/s airflow |
| Storage Temperature | - 40 ~ 85° C (-40 ~185° F) |
| Humidity | Operating: 40° C @ 95% relative humidity, non-condensing; Storage: 60° C @ 95%relative humidity, non-condensing |
| Vibration Resistance | 3.5 Grms |
| Certification | |
| EMC | CE, FCC |
| Mechanical | |
| Dimensions | 146 x 102 mm (5.75" x 4.02") |
Ready-to-use power-efficient edge AI solution
High Performance with Build-in NPU, but Low Power Computing
- 8x Kryo 670 CPU from 1.9 up to 2.7 GHz + Adreno GPU 643
- Up to 12.5 INT8 TOPS from integrated NPU for AI inference applications
Rugged On-Board Design and Extended Temperature Range
- 8GB LPDDR5 on-board memory and 128GB UFS or 64GB eMMC on-board storage
- -20~70°C extended operating temperature range
- 3 x standalone M.2 slots for solid extension: E-Key 2230 for Wi-Fi/BT, B-Key 3052 for 4G/LTE, M-Key 2280 for NVMe SSD
Flexible OS and Longevity Support
- Multi-OS support with Windows 11 IoT LTSC and Ubuntu (22.04)
- Hardware and Software technical support up to 2036
Multi-I/O Interface and Multi-Display
- 2x GbE, 6x USB, 4x COM, 2x I2C, 2x MIPI-CSI, 1x 8b GPIO, 1x Audio Combo Jack
- LVDS or eDP (Optional) + HDMI