A-ECM-TGUC
11th Gen Intel® Core™ SoC i5/i3 BGA Processor 3.5” Single Board computer
- Bottom Layer Soldered Processor
- Single 260-pin SO-DIMM DRAM Socket, Max, Up to 32GB DDR4 3200MTs (non-ECC Supported)
- Triple display, 2 x DP++, 1 x 2CH LVDS
- Expansion Slot, M.2 Key-B, M.2 Key-E, M.2 Key-M
- Dual Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
- TPM
- DC-Input, +12~+24VDC
Datasheet
Product Specification
| System Information | |
| Processor | Onboard 11th Gen. Intel® Core™ SoC i5/i3 BGA Processor Intel® Core™ i3-1115G4 (up to 3.0GHz, dual-core, 6M Cache, TDP: 28/15/12W) Intel® Core™ i5-1135G7 (up to 2.4GHz, quad-core, 8M Cache, TDP: 28/15/12W) |
| System Memory | Single 260-pin DDR4 SODIMM Socket, Supports Up to 32GB DDR4 3200MTs SDRAM (non ECC only) |
| I/O Chipset | NCT6126 |
| BIOS Information | AMI BIOS, 256Mbit SPI Flash ROM |
| Watchdog Timer | H/W Reset, 1sec. ~ 65535sec and 1sec. or 1min./step |
| H/W Status Monitor | CPU & system temperature monitoring Voltages monitoring |
| TPM | Onboard NuvoTon NPCT754AADYX support TPM 2.0 (BOM optional) |
| Expansion | |
| Expansion | 1 x M.2 Type M 2280 (with 1 x PCI-e Gen4 x4) 1 x M.2 Type B 3042/3052/2242 (with SATA and USB2.0, USB 3.0, with 1 x SIM card slot, support WWAN+GNSS or SSD) * Only supports one SIM card (co-lay 1 x 10pin FPC connector for uSIM card adapter) 3.8V for 5G 1 x M.2 Key E 2230 support WiFi module (1 x PCI-e x 1 & USB 2.0 Signal)) |
| Storage | |
| Storage | 1 x M.2 (Key-B, 2242) 1 x M.2 (Key-M, 2280) 1 x SATA III |
| I/O | |
| USB Port | 3 x USB 3.2 Gen 2x1 5 x USB 2.0 |
| COM Port | 1 x RS-232/422/485 5 x RS232 |
| SATA | 1 x SATA III |
| DIO | 1 x 2 x 6 pin, pitch 2.00mm connector for GPIO: 8 bits & +3.3S Level |
| Other | 2 x LAN |
| Display | |
| Graphic Chipset | Intel® Tiger Lake UP3 SoC Processor integrated Gen12 graphics |
| Spec. & Resolution | DP++ Max resolution 4096x2160@60Hz LVDS Max resolution 1920 x 1080 Dual channel 18/24-bits |
| Multiple Display | Triple Display |
| LVDS | 1 x LVDS: 1920 x 1080 Dual channel 18/24-bits LVDS (Chrontel CH7513A-BF eDP to LVDS) |
| Audio | |
| Audio Codec | RealTek ALC888S-VD2-GR |
| Audio Interface | Mic-In, Line-In, Line-Out in pin header |
| Certifications | |
| Certification Information | CE, FCC Class B |
| Ethernet | |
| LAN Chipset | Intel® I219LM Gigabit Ethernet Intel® I225V Gigabit Ethernet |
| Ethernet Interface | 1 x 10/100/1000/2.5G Base-Tx GbE compatible 1 x 10/100/1000 Base-Tx GbE compatible |
| LAN Port | 2 x RJ-45 |
| Mechanical & Environmental | |
| Operating Temperature | Standard Temperature: 0°C ~ 60°C (-4~140°F) with 0.5m/s air flow |
| Storage Temperature | -40°C ~ 85°C (-40°F ~ 185°F) |
| Operating Humidity | 40°C @ 95% Relative Humidity, Non-condensing |
| Weight | 0.44lbs (0.2kg) |
| Vibration Test | 1.5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 30min/Axis, 3 Axis |
| Shock Test | 10G, IEC 60068-2-27, Half Sine, 11ms, Z Axis |
| Drop Test | ISTA 2A, IEC-60068-2-32 Test : Ed, 1 Corner, 3 Edges, 6 Faces |
| Power Requirement | DC in +12V ~ +24V |
| ACPI | Single power ATX Support S0,S3, S4, S5 ACPI 5.0 Compliant |
| Power Mode | AT/ATX (Default Setting: AT) |
| Dimension (L x W) | 5.7" x 4" (146mm x 101mm) |
| Software Support | |
| OS Information | Win 10, Linux |