AD-AIMB-787
10th Gen Intel® Core™ i9/i7/i5/i3 ATX motherboard. DP/DVI/VGA, DDR4, USB 3.2, M.2
- Intel® 10th generation Core™ i9/i7/i5/i3/Pentium®/Celeron® processor with Q470E chipset
- Four DIMM sockets up to 128 GB DDR4 2933
- Triple display DP/DVI-D/VGA and dual GbE LAN
- M.2, SATA RAID 0, 1, 5, 10, USB 3.2
- Supports Intel vPro, AMT & TPM technologies
- Note 1: TPM module is required to enable Intel vPro and TPM technologies.
- Note 2: Legacy platform is not supported.
| Model | AIMB-787G2-00A4 | AIMB-787G2-00A4U |
|---|---|---|
| Processor System | ||
| CPU | 10th Gen Intel® Core™ Processors | 10th Gen Intel® Core™ Processors |
| Socket Q'ty | 1 x LGA1200 | 1 x LGA1200 |
| TDP | Up to 65 W | Up to 65 W |
| Base Frequency | 2.8GHz | Up to 3.8 GHz |
| Core Number | Up to 10 | Up to 10 |
| L3 Cache | Up to 20 MB | Up to 20 MB |
| Chipset | Intel Q470E/H420E | Intel Q470E/H420E |
| BIOS | AMI 256 Mbit SPI Flash | AMI 256 Mbit SPI Flash |
| Integrated Graphics | Yes | Yes |
| Expansion Interface | ||
| PCI Express x 16 | 1 (Gen 3) | 1 (Gen 3) |
| PCI Express x 4 | 4 (Gen 3) | 4 (Gen 3) |
| PCI | 2 | 2 |
| Memory | ||
| Type and Speed | Dual-Channel DDR4 2666/2933 MHz | Dual-Channel DDR4 2666/2933 MHz |
| ECC Support | - | - |
| Slots | 4 x 288-pin DIMM | 4 x 288-pin DIMM |
| NVMe M.2 | M.2 2280, M-Key | M.2 2280, M-Key |
| LAN | ||
| Controller | LAN1: Intel® I219-LM, LAN2: Intel® I210-AT | LAN1: Intel® I219-LM, LAN2: Intel® I210-AT |
| Interface | 10/100/1000 Mbps | 10/100/1000 Mbps |
| Rear I/O Interface | ||
| VGA | 1 | 1 |
| Display | 1 | 1 |
| Ethernet | 2 | 2 |
| USB | 14 (6 USB 3.2 and 8 USB 2.0) | 14 (6 USB 3.2 and 8 USB 2.0) |
| Audio | 2 (Mic-in, Line-out) | 2 (Mic-in, Line-out) |
| Serial | 6 | 6 |
| WatchDog Timer | ||
| Output | System Reset | System Reset |
| Interval | Programmable 1~255 sec | Programmable 1~255 sec |
| Environment | ||
| Operating Temperature | 0 ~ 60 °C (32 ~ 140 °F) | 0 ~ 60 °C (32 ~ 140 °F) |
| Non-Operational Temperature | -40 ~ 85° C (-40 ~ 185° F) | -40 ~ 85° C (-40 ~ 185° F) |
| Operating Humidity | 95% @ 40 °C (Non-condensing) | 95% @ 40 °C (Non-condensing) |
| Non-Operating Humidity (Non-condensing) | 95% RH @ 60 °C | 95% RH @ 60 °C |
| Physical Characteristics | ||
| Dimension (L x H) | 304.8 x 244 mm (12" x 9.6") | 304.8 x 244 mm (12" x 9.6") |
Case Study: Machine Automation Solutions: IC Wafer Prober and Tester
Background
Wafer testing is a crucial step performed during semiconductor device fabrication. It is performed by a piece of testing equipment called a wafer prober. The process of wafer testing can be referred to in several ways: Wafer Final Test (WFT), Electronic Die Sort (EDS) and Circuit Probe (CP) are common.
This project demanded advanced data acquisition devices to activate wafers and measure their electronic characteristics. Advantech's solution included a high sampling rate, individual analog input cards, and a convenient software development kit that satisfied technical requirements. This comprehensive solution effectively controlled costs and shortened development time for IC wafer testing machines.
System Requirements
The customer required precise, accurate measurements for electrical characteristics on the wafer prober. To achieve this goal, the amount of peripheral limited switches/devices need to be controlled in time to precise positions. The tester needed analog outputs with 16-bit resolution to activate wafers and individual 8-ch analog inputs with a simultaneous 250KS/s sampling rate to accurately measure the electrical characteristics of the wafers.
System Description
PCIE-1753 controls up to 96 peripheral limited switches/ devices in time, while the high-density DIO card satisfies pre cise position requirements. PCIE-1812 and PCIE-1824 meet wafer tester needs for analog output to activate and accurately measure electrical characteristics. PCIE-1824 offers high-density analog output channels which can activate up to 16-point to be measured on the wafer. After wafer activation, PCIE-1812 can simultaneously measure eight-point electrical characteristics of the wafer in a short time span.