A-ECM-TGU
11th Gen Intel® Core™ SoC i7/i5/i3 & Celeron BGA Processor 3.5” Single Board Computer
- Bottom Layer Soldered Processor
 - Single 260-pin SO-DIMM DRAM Socket, Max, Up to 32GB DDR4 3200MTs (non-ECC Supported)
 - Four Display, 2 x DP++, 1 x 2CH LVDS, 1 x eDP
 - Expansion Slot, M.2 Key-B, M.2 Key-E, M.2 Key-M
 - Three Gigabit Ethernet, 1 x 2.5GbE, 2 x 1GbE
 - Wide Temperature -20°C ~ 60°C sku supported
 - DC-Input, +12~+24VDC
 
Datasheet
              
          Product Specification
              

| System Information | |
| Processor | Onboard 11th Gen. Intel® Core™ SoC i7/i5/i3 & Celeron® BGA Processor Intel® Core™ i7-1185G7E, i7-1185GRE (up to 4.4GHz, quad-core, 12M Cache, TDP: 28/15/12W) Intel® Core™ i5-1145G7E, i5-1145GRE (up to 4.1GHz, quad-core, 8M Cache, TDP: 28/15/12W) Intel® Core™ i3-1115G4E, i3-1115GRE (up to 3.9GHz, dual-core, 6M Cache, TDP: 28/15/12W) Intel® Celeron® 6305E (up to 1.8GHz, dual-core, 4M Cache, TDP: 15W)  | 
| System Memory | Single 260-pin DDR4 SODIMM Socket, Supports Up to 32GB DDR4 3200MTs SDRAM (non ECC only) | 
| I/O Chipset | ITE IT8528E | 
| BIOS Information | AMI BIOS, 256Mbit SPI Flash ROM | 
| Watchdog Timer | H/W Reset, 1sec. ~ 65535sec and 1sec. or 1min./step | 
| H/W Status Monitor | CPU & system temperature monitoring Voltages monitoring | 
| TPM | TPM 2.0 (Onboard NuvoTon NPCT754AADYX) | 
| Expansion | |
| Expansion | 1 x M.2 Key E 2230 support WiFi module (with PCI-e x1 & USB 2.0 Signal) 1 x M.2 Key B 3042/2242 (with PCIe x1, SATA and USB2.0 signal, with 1 x SIM card slot) standard package with 52 to 42 bracket + screw set ; Support 4G, no 5G (no USB3.0 signal). 1 x M.2 Key M support 2260/2242 (with 1 x PCI-e Gen4 x4 signal), standard package with 60 to 42 bracket + screw set  | 
| Storage | |
| Storage | 1 x M.2 (Key-B, 2242) 1 x SATA III  | 
| I/O | |
| USB Port | 4 x USB 3.2 Gen 2x1 4 x USB 2.0  | 
| COM Port | 2 x RS-232/422/485 4 x RS232  | 
| SATA | 1 x SATA III | 
| DIO | 1 x 2 x 6 pin, pitch 2.00mm connector for GPIO: 8 bits & +3.3S Level | 
| Other | 3 x LAN | 
| Display | |
| Graphic Chipset | Intel® Tiger Lake UP3 SoC Processor integrated Gen12 graphics | 
| Spec. & Resolution | DP++ Max resolution 4096x2160@60Hz LVDS Max resolution 1920 x 1080 Dual channel 18/24-bits eDP1.3 Max resolution 4096x2160@60Hz  | 
| Multiple Display | Four Display | 
| LVDS | 1 x LVDS: 1920 x 1080 Dual channel 18/24-bits LVDS (Chrontel CH7511B-BFI eDP to LVDS) | 
| Audio | |
| Audio Codec | 92HD73C Tempo | 
| Audio Interface | Mic-In, Line-In, Line-Out | 
| Audio Amplifier | 3W Amplifier | 
| Certifications | |
| Certification Information | CE FCC Class B  | 
| Ethernet | |
| LAN Chipset | Intel® I225LM, I210AT for standard temperature Intel® I225IT, I210IT for wide temperature  | 
| Ethernet Interface | 1 x 10/100/1000/2.5G Base-Tx GbE compatible 2 x 10/100/1000 Base-Tx GbE compatible  | 
| LAN Port | 3 x RJ-45 | 
| Mechanical & Environmental | |
| Operating Temperature | Standard Temperature: 0°C ~ 60°C (-4~140°F) with 0.5m/s air flow Wide Temperature: -20°C ~ 60°C(32~140°F) with 0.5m/s air flow for Wide Temp CPU SKU  | 
| Storage Temperature | -40°C ~ 85°C (-40°F ~ 185°F) | 
| Operating Humidity | 40°C @ 95% Relative Humidity, Non-condensing | 
| Weight | 0.44lbs (0.2kg) | 
| Vibration Test | 1.5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 30min/Axis, 3 Axis | 
| Shock Test | 10G, IEC 60068-2-27, Half Sine, 11ms, Z Axis | 
| Drop Test | ISTA 2A, IEC-60068-2-32 Test : Ed, 1 Corner, 3 Edges, 6 Faces | 
| Power Requirement | DC in +12V ~ +24V | 
| ACPI | Single power ATX Support S0,S3, S4, S5 ACPI 5.0 Compliant  | 
| Power Mode | AT/ATX (Default Setting: AT) | 
| Dimension (L x W) | 5.7" x 4" (146mm x 101mm) | 
| Software Support | |
| OS Information | Win 10 Linux  |