ID-DDR4 ECC UDIMM VLP
Interface: DDR4, Form Factor: ECC UDIMM VLP, Function: ECC Unbuffered Memory
- Very Low Profile Specialized For Use in 1U System
- Single Error Correction and Detection Available
- Fully Tested and Optimized for Stability and Performance
- Uses Original IC to Meet Strict Industrial Standards
- Anti-Sulfuration Protection Against Harsh Environments
- JEDEC Standard 1.2V (1.26V~1.14V)
- Operating Environment : 0°C ~ 85°C
- 30μ” Gold Finger
- RoHS Compliance
- CE/FCC Certification
Model Name | DDR4 ECC UDIMM VLP |
| DDR Generation | DDR4 Memory |
| DIMM Type | ECC UDIMM VLP |
| Speed | 2133 MT/s, 2400 MT/s, 2666 MT/s, 2933 MT/s, 3200 MT/s |
| Density | 4GB, 8GB, 16GB, 32GB |
| Function | ECC Unbuffered Memory |
| Pin Number | 288pin |
| Bus Width | x72 |
| Voltage | 1.2V |
| PCB Height | 0.738 Inches |
| Operating Temperature | 0°C ~ 95°C (Tc) |
| 30μ” Gold Finger | Y |
| Anti-Sulfuration | Y |
DDR4 ECC UDIMM VLP offers a very low-profile design and the industry's fastest memory speed with 2666MT/s, and it is fully compatible with the Intel® Purly platform and 1U devices. The modules come equipped with 30μ” Gold Fingers and include single bit error correction. Available capacities are 4GB, 8GB, and 16GB. 2133MT/s and 2400MT/s modules are also available.
VLP modules are specialized for use in 1U systems, such as blade server data centers, where system height is lower than 1.18 inches. The design of these modules improves airflow inside the system and reduces thermal impact.
ECC modules are designed to detect and correct single-bit errors that occur during data storage and transmission. ECC modules use Hamming Code or Triple Modular Redundancy for error detection and correction, and manage error corrections on their own, without requesting that the data source resend original data.
| P/N | IC Config. | Rank | Temp. | Description |
| M4C0-4GSSSCEM | 512M x 8 | 1R x 8 | 0°C ~ 95°C (Tc) | DDR4 3200 4GB ECC UDIMM VLP |
| M4C0-8GSSTCEM | 512M x 8 | 2R x 8 | 0°C ~ 95°C (Tc) | DDR4 3200 8GB ECC UDIMM VLP |
| M4C0-8GS1SCEM | 1G x 8 | 1R x 8 | 0°C ~ 95°C (Tc) | DDR4 3200 8GB ECC UDIMM VLP |
| M4C0-AGS1TCEM | 1G x 8 | 2R x 8 | 0°C ~ 95°C (Tc) | DDR4 3200 16GB ECC UDIMM VLP |
| M4C0-BGM2TCEM | 2G x 8 | 2R x 8 | 0°C ~ 95°C (Tc) | DDR4 3200 32GB ECC UDIMM VLP |
| M4C0-BGS2TCEM | 2G x 8 | 2R x 8 | 0°C ~ 95°C (Tc) | DDR4 3200 32GB ECC UDIMM VLP |
LOW PROFILE SERIES
OPTIMIZED FOR SPACE-CONSTRAINED COMPUTING
As the demand for high-performance computing and complex data-driven applications increases, space constraints have become a significant challenge.
Low Profile Series tackles these issues with its innovative low-profile design, offering space-saving benefits that enhance system flexibility, improve thermal management, and optimize heat dissipation.
40% SYSTEM SPACE SAVING
With a compact 0.74-inch PCB, the Low Profile Series enables denser memory configurations. This design allows server administrators to maximize memory capacity in constrained spaces without compromising performance.
The saved space also facilitates flexible server designs, optimizing deployments for maximum efficiency and scalability.
IMPROVED THERMAL EFFICIENCY
The compact design of the VLP (Very Low Profile) / ULP (Ultra Low Profile) Series provides greater flexibility in system layout and configuration.
Positioned close to heat sources like CPUs and GPUs, these modules enhance airflow around components, improving cooling efficiency and reducing overall system temperature. This optimization boosts system stability and reliability while supporting flexible server designs.
LOWER SYSTEM POWER CONSUMPTION
The Low Profile Series enhances thermal efficiency, leading to reduced system power consumption. By improving cooling and minimizing reliance on fans and other cooling mechanisms, these modules lower energy costs while contributing to a sustainable and reliable server infrastructure.
