ID-DDR5 CAMM2
Interface: DDR5, Form Factor: CAMM2, Function: Non-ECC Unbuffered Memory
Get Double Bandwidth with a Single Module
- Dual-channel design with 128-bit bandwidth
- Blazing-fast 6400MT/s data rates
- Saves up to 60% of mounting space
- Stub-free layout for optimized signal integrity
- Screw-lock mechanism ensures strong vibration resistance
Product Specification
| DDR Generation | DDR5 Memory |
| DIMM Type | CAMM2 |
| Speed | 6400 MT/s |
| Density | 32GB, 64GB |
| Function | Non-ECC Unbuffered Memory |
| Pin Number | 644pin |
| Bus Width | x128 |
| Voltage | 1.1V |
| PCB Height | 1.57 inches |
| Operating Temperature | 0°C to 95°C (Tc) |
| Anti-Sulfuration | Y |
CAMM2 redefines high-performance embedded memory with an ultra-slim form factor. The module enhances signal integrity with simplified motherboard routing and reduces mounting space by up to 60%, allowing greater flexibility for custom cooling and system design.
The module features a screw-lock mechanism that ensures vibration resistance in rugged environments. Powered by DDR5 and a 128-bit dual-channel architecture, CAMM2 delivers speeds up to 6400 MT/s—enabling high bandwidth and stable performance for data-intensive industrial applications.
Ordering Information
| P/N | IC Config. | Rank | Temp. | Description |
| M5W0-BGM2FC1S | 2G x 8 | 1R x 8 | 0°C ~ 95°C (Tc) | DDR5 6400 32GB CAMM2 |
| M5W0-CGM2FC1S | 4G x 8 | 1R x 8 | 0°C ~ 95°C (Tc) | DDR5 6400 64GB CAMM2 |
AI MEMORY SERIES
NEXT-GEN MEMORY SOLUTIONS DESIGNED FOR HPC AND AI-INTENSIVE APPLICATIONS
AI Memory series is crafted to meet the evolving needs of modern AI computing. Featuring high bandwidth, low latency, outstanding scalability, and energy-efficient architecture, it delivers the performance required for intensive AI training and inference across both cloud and edge applications.
SCALABLE MEMORY EXPANSION2.0
Innodisk’s AI Memory series addresses diverse memory expansion challenges across platforms with efficiency and flexibility. CXL Memory Modules overcome capacity constraints when server DRAM slots are fully occupied. By leveraging the E3.S interface, the modules enable scalable memory expansion and simplify system upgrades without major hardware changes.
LPCAMM2 and CAMM2 bring modularity to traditionally soldered onboard memory. Instead of replacing the entire motherboard, users can easily upgrade or replace modules, improving serviceability and system longevity.
HIGH-SPEED DATA TRANSFER
AI Memory products leverage the latest high-performance DRAM IC technologies to support the growing demands of AI applications that require rapid data processing.
CXL Memory Modules and CAMM2 utilize industry-leading DDR5 6400 MT/s DRAM ICs, delivering top-tier memory bandwidth for latency-sensitive applications. LPCAMM2 adopts LPDDR5X DRAM ICs and supports speeds up to 8533 MT/s, offering the best performance in its class for edge AI systems.
COMPACT DESIGN FOR OPTIMIZED SPACE EFFICIENCY
CAMM2 and LPCAMM2 feature an innovative 128-bit dual-channel architecture that reduces memory slot requirements and simplifies motherboard routing. Compared to traditional SODIMM, they save up to 60% of mounting space, allowing for slimmer system designs and greater layout flexibility. Their compact form factors are especially well-suited for fanless systems, compact edge devices, and other space-constrained
