ID-DDR5 ECC UDIMM VLP
Interface: LPDDR5X, Form Factor: ECC UDIMM VLP, Function: ECC Unbuffered Memory
- Very Low Profile Specialized For Use in 1U System
- Single Error Correction and Detection Available
- Fully Tested and Optimized for Stability and Performance
- Uses Original IC to Meet Strict Industrial Standards
- On module Power Management IC (JEDEC Standard: 1.1V)
- 30μ” Gold Finger
- Operating Environment: 0°C to 95°C (Tc)
- Anti-Sulfuration Protection Against Harsh Environments
- RoHS Compliance
- CE/FCC Certification
Product Specification
| DDR Generation | DDR5 Memory |
| DIMM Type | ECC UDIMM VLP |
| Speed | 4800 MT/s, 5600 MT/s |
| Density | 16GB, 32GB |
| Function | ECC Unbuffered Memory |
| Pin Number | 288pin |
| Bus Width | x72 |
| Voltage | 1.1V |
| PCB Height | 0.738 Inches |
| Operating Temperature | 0°C to 95°C (Tc) |
| 30μ” Gold Finger | Y |
| Anti-Sulfuration | Y |
DDR5 ECC UDIMM VLP offers a very low-profile design and the industry's fastest memory speed with 4800MT/s, 5600MT/s and it is fully compatible with the Intel® Purely platform and 1U devices. The modules comply with all relevant JEDEC standards and are available in 16GB and 32GB capacities.
VLP modules are specialized for use in 1U systems, such as blade server data centers, where system height is lower than 1.18 inches. The design of these modules improves airflow inside the system and reduces thermal impact.
Ordering Information
| P/N | IC Config. | Rank | Temp. | Description |
| M5C0-AGS2SCZQ | 2G x 8 | 1R x 8 | 0°C ~ 95°C (Tc) | DDR5 5600 16GB ECC UDIMM VLP |
| M5C0-AGM2SCZQ | 2G x 8 | 1R x 8 | 0°C ~ 95°C (Tc) | DDR5 5600 16GB ECC UDIMM VLP |
| M5C0-BGS2TCZQ | 2G x 8 | 2R x 8 | 0°C ~ 95°C (Tc) | DDR5 5600 32GB ECC UDIMM VLP |
| M5C0-BGM2TCZQ | 2G x 8 | 2R x 8 | 0°C ~ 95°C (Tc) | DDR5 5600 32GB ECC UDIMM VLP |
LOW PROFILE SERIES
OPTIMIZED FOR SPACE-CONSTRAINED COMPUTING
As the demand for high-performance computing and complex data-driven applications increases, space constraints have become a significant challenge.
Low Profile Series tackles these issues with its innovative low-profile design, offering space-saving benefits that enhance system flexibility, improve thermal management, and optimize heat dissipation.
40% SYSTEM SPACE SAVING
With a compact 0.74-inch PCB, the Low Profile Series enables denser memory configurations. This design allows server administrators to maximize memory capacity in constrained spaces without compromising performance.
The saved space also facilitates flexible server designs, optimizing deployments for maximum efficiency and scalability.
IMPROVED THERMAL EFFICIENCY
The compact design of the VLP (Very Low Profile) / ULP (Ultra Low Profile) Series provides greater flexibility in system layout and configuration.
Positioned close to heat sources like CPUs and GPUs, these modules enhance airflow around components, improving cooling efficiency and reducing overall system temperature. This optimization boosts system stability and reliability while supporting flexible server designs.
LOWER SYSTEM POWER CONSUMPTION
The Low Profile Series enhances thermal efficiency, leading to reduced system power consumption. By improving cooling and minimizing reliance on fans and other cooling mechanisms, these modules lower energy costs while contributing to a sustainable and reliable server infrastructure.
