ID-DDR5 UDIMM ULP
Interface: DDR5, Form Factor: UDIMM ULP, Function: Non-ECC Unbuffered Memory
- Saves more than 40% of system space with ULP (Ultra Low Profile) design
- Speeds up to 5600MT/s with capacities up to 32GB
- Operating Environment: 0°C ~ 95°C (Tc)
- DDR5 original-grade IC equipped with on-die ECC functionality
- DDR5 on-module PMIC and dual sub-channel structure
- 30μ” gold finger ensures durability, with anti-sulfuration shielding against harsh conditions
- Complies with RoHS and CE / FCC certifications
Product Specification
| Model Name | DDR5 UDIMM ULP |
| DDR Generation | DDR5 Memory |
| DIMM Type | UDIMM ULP |
| Speed | 4800 MT/s, 5600 MT/s |
| Density | 16GB, 32GB |
| Function | Non-ECC Unbuffered Memory |
| Pin Number | 288pin |
| Bus Width | x64 |
| Voltage | 1.1V |
| PCB Height | 0.7 Inches |
| Operating Temperature | 0°C ~ 95°C (Tc) |
| 30μ” Gold Finger | Y |
| Anti-Sulfuration | Y |
BORN FOR SUPERIOR PERFORMANCE
As AI drives growing data transmission demands, DDR5 DRAM stands out as the optimal choice. With advancements in design and development, DDR5 offers up to 32GB capacity and 5600MT/s speed, surpassing previous generations in overall performance.
OVER 40% SPACE SAVING, COOLING BOOST AND SYSTEM FLEXIBILITY
The DDR5 UDIMM ULP, standing at just 17.78mm in height, achieves a more than 40% reduction in space usage. This ultra low-profile design reduces PCB usage and decreases resource consumption. It also improves airflow, enhances memory cooling, conserves fan energy, and offers greater flexibility in system configuration.
Ordering Information
| P/N | IC Config. | Rank | Temp. | Description |
| M5U0-AGS23CZQ | 2G x 8 | 1R x 8 | 0°C ~ 95°C (Tc) | DDR5 5600 16GB UDIMM ULP |
| M5U0-AGM23CZQ | 2G x 8 | 1R x 8 | 0°C ~ 95°C (Tc) | DDR5 5600 16GB UDIMM ULP |
| M5U0-BGS24CZQ | 2G x 8 | 2R x 8 | 0°C ~ 95°C (Tc) | DDR5 5600 32GB UDIMM ULP |
| M5U0-BGM24CZQ | 2G x 8 | 2R x 8 | 0°C ~ 95°C (Tc) | DDR5 5600 32GB UDIMM ULP |
LOW PROFILE SERIES
OPTIMIZED FOR SPACE-CONSTRAINED COMPUTING
As the demand for high-performance computing and complex data-driven applications increases, space constraints have become a significant challenge.
Low Profile Series tackles these issues with its innovative low-profile design, offering space-saving benefits that enhance system flexibility, improve thermal management, and optimize heat dissipation.
40% SYSTEM SPACE SAVING
With a compact 0.74-inch PCB, the Low Profile Series enables denser memory configurations. This design allows server administrators to maximize memory capacity in constrained spaces without compromising performance.
The saved space also facilitates flexible server designs, optimizing deployments for maximum efficiency and scalability.
IMPROVED THERMAL EFFICIENCY
The compact design of the VLP (Very Low Profile) / ULP (Ultra Low Profile) Series provides greater flexibility in system layout and configuration.
Positioned close to heat sources like CPUs and GPUs, these modules enhance airflow around components, improving cooling efficiency and reducing overall system temperature. This optimization boosts system stability and reliability while supporting flexible server designs.
LOWER SYSTEM POWER CONSUMPTION
The Low Profile Series enhances thermal efficiency, leading to reduced system power consumption. By improving cooling and minimizing reliance on fans and other cooling mechanisms, these modules lower energy costs while contributing to a sustainable and reliable server infrastructure.
