ID-E3.S 4TS2-P
Form Factor: E3.S; Flash Type: 3D TLC; Capacity: 400GB~12.8TB; Interface: PCIe Gen. 4x4

- PCIe Gen. 4x4, NVMe 1.4
- iCell technology for power loss protection
- Stable sustained performance
- LDPC ECC engine supported
- Dynamic thermal management
Model | E3.S 4TS2-P |
Form Factor | E3.S |
Flash Type | 3D TLC |
Capacity | 400GB~12.8TB |
Sequential R/W (MB/sec, max.) | 6,000/3,500 |
Max. Power Consumption | TBD |
Max. Channels | 8 |
Thermal Sensor | Y |
External DRAM Buffer | Y |
TCG Opal | Y |
H/W Write Protect | N |
Dimension (WxLxH/mm) | 76 x 112.75 x 7.5 |
Vibration | 20G@7~2000Hz |
Shock | 1500G@0.5ms |
MTBF | >3 million hours |
Storage Temperature | -40°C ~ +85°C |
BORN FOR SUPERIOR PERFORMANCE
The E3.S 4TS2-P features a PCIe Gen 4 x4 interface and 3D TLC NAND Flash. This series offers high DWPD, wide temperature support, and up to 12.8TB of capacity, making it ideal for edge server applications. Enhanced thermal management and hot-swap functionality, along with SSD maintenance features, position it as the new mainstream choice for data center and edge server applications.
WIDE TEMPERATURE TOLERANCE FOR EXTREME SCENARIOS
The E3.S 4TS2-P is engineered for superior thermal management in edge servers, with a temperature range of -40°C to 85°C. Its unique form factor and Dynamic Thermal Throttling mechanism enable best performance under intensive workloads.
Ordering Information
Operating Temperature | Standard Grade (0°C ~ 70°C) | Industrial Grade (-40°C ~ 85°C) |
400GB | DSE3S-400DP2KCAEFP | DSE3S-400DP2KWAEFP |
800GB | DSE3S-800DP2KCAEFP | DSE3S-800DP2KWAEFP |
1.6TB | DSE3S-1T6DP2KCAEFP | DSE3S-1T6DP2KWAEFP |
3.2TB | DSE3S-3T2DP2KCAEFP | DSE3S-3T2DP2KWAEFP |
6.4TB | DSE3S-6T4DP2KCBEFP | DSE3S-6T4DP2KWBEFP |
12.8TB | DSE3S-12TDP2KCBEFP | DSE3S-12TDP2KWBEFP |
Operation temperature based on temperature obtained from S.M.A.R.T.
E3.S 4TS2-P specifications are subject to change.
Enterprise and Datacenter Standard Form Factor (EDSFF)
Enterprise and Datacenter Standard Form Factor (EDSFF) encompasses a spectrum of form factors crafted for various storage requirements within the dynamic data center environment. These SSD variations incorporate advantages in capacity, thermal and power management, scalability, manageability, and performance.

PCIe Gen. 4x4, NVMe SSD.
Form Factor: E3.S; Flash Type: 3D TLC;
Capacity: 400GB~12.8TB

