I-TANK-XM812
High-Performance AMD Ryzen™ 7000/8000 Series AM5 Processor, Fanless Embedded Computer
- Supported CPUs:
- AMD Ryzen™ 7000/8000 Series AM5 Processor
- AMD Ryzen™ 7 8700G 4.2GHz (up to 5.1GHz, 8-core, 65W)
- AMD Ryzen™ 5 8600G 4.3GHz (up to 5.0GHz, 6-core, 65W)
- 2 x 2.5GbE ports
- Multiple USB ports and serial ports
- Multiple internal expansion boards for flexible selection
- Various optional backplanes and chassis
- CE/FCC compliant
Datasheet
| Form Factor | |
| SBC Form Factor | CPU: AMD Ryzen™ 7000/8000 Series AM5 Processor AMD Ryzen™ 7 8700G 4.2GHz (up to 5.1GHz, 8-core, 65W) AMD Ryzen™ 5 8600G 4.3GHz (up to 5.0GHz, 6-core, 65W) Chipset: AMD B650 System Memory: 2 x SO-DIMM DDR5 5200 (8GB pre-installed) (up to 96GB) Power: DC Jack: 12 V~28 V DC Terminal Block: 12 V~28 V DC Consumption: 12V @ 6.95A (AMD Ryzen™ 7 8700G with 8GB memory) |
| I/O Interface | |
| I/O Ports | USB: 6 x USB 3.2 Gen2 Ethernet: 2 x RJ-45: 2.5 GbE by Intel® I226V (colay I226LM) COM Port: 2 x RS-232/422/485, 4 x RS-232 Digital I/O:12-bit Digital I/O (6-in/ 6-out) Display:1 x HDMI , 1 x DP++ , 2 x USB Type-C (Display + USB 3.2 Gen2) Audio: 1 x Mic, 1 x Line-out TPM: 1 x 20pin TPM connector (Optional TPM-IN03 module) Watchdog Timer:Programmable 1 ~ 255 sec/min |
| Expansion Slots | |
| Expansion Slots | M.2: 1 x 2280 M-key (PCIe Gen4 x4) 1 x 2230 A-key (USB 2.0 + PCIe Gen3 x1) Backplane: Optional |
| System | |
| Cooling method / System Fan | Fanless 4-pin external system fan connector |
| Drive Bays | 2 x 2.5” SATA 6Gb/s HDD/SSD bay (RAID 0/1 supported) |
| Indicator&Buttons | |
| Buttons | 1 x Power button 1 x Reset button 1 x AT/ATX switch |
| Indicators | 1 x Power LED (green) 1 x HDD LED (yellow) |
| Physical Characteristics | |
| Construction | Extruded aluminum alloy |
| Color | |
| Color | Black |
| Dimensions | |
| Dimensions | 230.6 x 255 x 68.7 |
| Weight | |
| Weight | 3.18/5 kg |
| Environment | |
| Operating Temperature | -20°C ~ 60°C (CPU TDP50W & SSD) -20°C ~ 50°C (CPU TDP65W & SSD) |
| Humidity | 10% ~ 95% non-condensing |
| Operating Vibration | IEC68-2-27 half-sine, 5G, 11ms, 100 shocks (With SSD) |
| Operating Shock | Random Vibration Mode, MIL-STD-810H 514.8C-I (With SSD) |
| Safety & EMC | CE/FCC compliant |
| OS Support | |
| OS Support | Microsoft Windows 10 / Windows 11, Linux |
TANK-XM series: Unleash Industrial Intelligence for the Future of Scalable Edge AI
In modern smart factories, data surges in milliseconds and AI workloads evolve just as fast. The TANK-XM series delivers a scalable, high-performance foundation for industrial edge AI. Supporting Intel® Core™ Ultra processors with AI Boost (NPU), 12th–14th Gen Intel® Core™ processors, and AMD Ryzen™ 7000/8000 series processors, it removes processing bottlenecks and enables efficient hybrid AI acceleration.
Unmatched Modularity with eChassis
A unique modular architecture that allows for flexible I/O, storage, and performance acceleration, reducing lead times and future-proofing your investment.
Industrial-Grade Hardened Hardware
Fanless design, wide operating temperature (-20°Cto 60°C), wide-range 12V-28V DC power input, and MILSTD- 810G compliance for shock and vibration. Features Intel Platform Trust Technology (PTT).
Desktop Performance at the Edge
Support for up to 65W TDP desktop processors from Intel and AMD, delivering significant performance gains for demanding single and multi-threaded applications.