SYS-822GS-NBRT
DP Intel 8U System with NVIDIA HGX B200 8-GPU supporting 32 DIMMs
- Dual Intel® Xeon® 6700/6500 series processors with P-cores, up to 350W TDP
- HGX B200 8-GPU SXM6 with NVSwitch, 1000W TDP per GPU, air cooled
- 32 DIMM slots supporting up to 8TB of memory
- 8 Hot-swap E1.S NVMe storage drives , 2 M.2 NVMe
- Up to 8 PCIe 5.0 x16 LP + 2 PCIe 5.0 x16 FHHL
- 1 USB 3.0 port, 1 USB 2.0 port, 1 Mini-DP port, 1 IPMI GbE LAN port, 2 10G NIC (X710)
- 6 redundant (3+3) 6600W Titanium level power supplies
- 8U air-cooled Front I/O system
Key Applications
- Scientific Research
- Conversational AI
- Business Intelligence & Analytics
- Drug Discovery
- Finance Services and Fraud Detection
- AI/Deep Learning Training and Inference
- Large Language Model (LLM) and Generative AI
- High Performance Computing (HPC)
- Autonomous Vehicle Technologies
Datasheet
Product Specification
| Product SKU | SYS-422GS-NBRT-LCC |
| Motherboard | Super X14DBG-LC+ |
| Processor | |
| CPU | Dual Socket E2 (LGA-4710) Intel® Xeon® 6700/6500 series processors with P-cores |
| Core Count | Up to 86C/172T; Up to 336MB Cache per CPU |
| Note | Supports up to 350W TDP CPUs (Air Cooled) |
| GPU | |
| Max GPU Count | 8 onboard GPUs |
| Supported GPU | NVIDIA SXM: HGX B200 8-GPU (180GB) |
| CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect |
| GPU-GPU Interconnect | NVIDIA® NVLink® with NVSwitch™ |
| System Memory | |
| Memory | Slot Count: 32 DIMM slots Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM Max Memory (2DPC): Up to 8TB 5200MT/s ECC DDR5 RDIMM |
| Memory Voltage | 1.1V |
| On-Board Devices | |
| Chipset | System on Chip |
| Network Connectivity | 2 RJ45 10GbE with Intel® X710 |
| Input / Output | |
| LAN | 1 RJ45 1 GbE Dedicated BMC LAN port |
| USB | 1 USB 3.0 Type-A port(Front) 1 USB 2.0 Type-A port(Front) |
| Video | 1 Mini-DP port(Front) |
| TPM | 1 TPM header |
| System BIOS | |
| BIOS Type | AMI 64MB UEFI |
| Management | |
| Software | SuperCloud Composer® Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New! |
| Power configurations | Power-on mode for AC power recovery ACPI Power Management |
| Security | |
| Hardware | Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
| Features | Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown |
| PC Health Monitoring | |
| CPU | Monitors for CPU Cores, Chipset Voltages, Memory 8+4 Phase-switching voltage regulator |
| FAN | Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors |
| Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Chassis | |
| Form Factor | 8U Rackmount |
| Model | CSE-GP807TS-R000NP-B2 |
| Dimensions and Weight | |
| Height | 13.8" (356 mm) |
| Width | 17.6" (449 mm) |
| Depth | 37.4" (950 mm) |
| Package | 26.38" (H) x 50.39" (W) x 28.74" (D) |
| Weight | Gross Weight: 341 lbs (155 kg) Net Weight: 293 lbs (133 kg) |
| Available Color | Silver |
| Front Panel | |
| LED | HDD activity LAN1 activity LAN2 activity Power Fail Power status System information (overheat/UID) |
| Buttons | Power On/Off UID |
| Expansion Slots | |
| PCI-Express (PCIe) Configuration | Default 8 PCIe 5.0 x16 LP slots 2 PCIe 5.0 x16 FHHL slots |
| Drive Bays / Storage | |
| Drive Bays Configuration | Default: Total 8 bays 8 front hot-swap E1.S NVMe drive bays |
| M.2 | 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 2280/22110; RAID support via S3808N controller) |
| System Cooling | |
| Fans | 12 heavy duty fans with optimal fan speed control |
| Air Shroud | 1 Air Shroud |
| Power Supply | 6x 6600W Redundant (3 + 3) Titanium Level (96%) power supplies |
| Operating Environment | |
| Environmental Spec. | Operating Temperature: 10°C to 35°C (50°F to 95°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
Front I/O 8U Air-Cooled HGX B200 System
Similar to the front I/O liquid-cooled system, the newly introduced front I/O air-cooled system features front accessible (or cold aisle accessible) NICs, DPUs, storage, and management components to streamline AI factory deployment without liquid-cooling infrastructure.
It features a compact 8U form factor while providing system memory expansion with 32 DIMM slots to deliver greater flexibility. The larger system memory complements the NVIDIA HGX B200’s HBM3e GPU memory by reducing CPU-GPU bottlenecks, and enhancing multi-job efficiency in virtualized environments, and accelerating data processing.
Front I/O, Enhanced Air-Cooled System for AI Factories
Front I/O 8U 8-GPU System : SYS-422GS-NBRT-LCC
| Overview | 8U Air-cooled System with Front I/O NICs, DPUs, Storage, and Management |
| CPU | Dual-Socket Intel® Xeon® 6700 Series Processors with P-cores, up to 350W |
| Memory | 32 DIMMs with up to 8TB at 5200MT/s or up to 4TB at 6400MT/s DDR5 RDIMM |
| NVLink | 5th Generation NVIDIA NVLink at 1.8TB/s |
| Networking | Up to 8 single-port NVIDIA ConnectX®-7 NICs or NVIDIA BlueField®-3 SuperNICs Up to two dual-port NVIDIA BlueField®-3 DPUs |
| Storage | 8 Hot-swap E1.S NVMe storage drive bays and 2 M.2 NVMe boot drives |
| Power Supply | 4x Redundant 6600W Titanium Level power supplies |
| Liquid Cooling with DLC-2 | Up to 98% system heat capture by liquid-cooling CPUs, GPUs, DIMMs, PCIe switches, VRMs, power supplies, and more |
