5G-Ready Industrial-Grade DDR5 DRAM Module
industrial-grade DRAM series, DDR5, DDR4, DDR3 are high-quality memory modules designed and developed for embedded and server needs providing a complete turnkey solution. They come with a warranty and value adds that include conformal coating, wide temperature, rugged design, and side fill allowing for customized design options.
DDR5 is faster and more reliable than DDR4, providing the speed and quantity requirements to meet the capacity, throughput, and low-latency demands of 5G applications like HPC, networking, deep learning, AI, Edge computing, smart medical, and super computing.
DDR5 DRAM modules features high bandwidth, greater memory density, and lower overall power consumption characteristic of modern 5G applications in various industries.
- Higher capacity: up to 4x total capacity
- Faster speeds: up to 2x overall speed
- Power regulation: more options with PMIC on-module
- Efficient power: voltage decreased to 1.1V
Industrial DRAM Advantage
Conformal Coating
Conformal coating is the chemical material layered over the components to protect against moisture, contaminants, dust, and acid or alkaline materials. The coating thickness ranges between 0.03 mm and 0.13 mm and meets electronic components IPC-A-610 standards.
Wide / Ultra Temperature
Wide / Ultra Temperature DRAM modules are built for extreme conditions. The Wide Temp. series functions from -40°C to 95°C, while the Ultra Temp. series supports temperatures from -40°C up to 125°C. Both feature 30µ"/45u" gold fingers for high-quality performance.
Anti-sulfuration
Anti-sulfuration effectively covers the resistors with a sulfur resistant material, ensuring smooth operation in harsh environments. It is available on all DDR4 and DDR5 modules.
Side Fill
Side fill technology improves the device’s reliability and extend product life during strong tremors or stringent thermal cycling. Resin is applied to 3 sides of the DRAM IC reinforcing the BGA and the PCB joint, so it can tolerate 1.5 times the amount of tension.
Heat Spreader
DRAM module add-on that helps to passively disperse heat by cooling the module by 4 to 5 percent.
Rugged Clips
Crafted from robust PANLITE® PC material, it clamps onto both sides of the DRAM slot, enhancing module stability and high-impact strength.
Industrial-grade DRAM series
Registered DIMM
Ideal for Server and AIOT
- Capacity: 2/4/8/16/32/64GB
- Generation: DDR3/DDR4/DDR5
Mini DIMM
Ideal for Server
- Capacity: 2/4/8/16/32GB
- Generation: DDR3/DDR4
- Functionality: Registered, ECC
Very Low Profile Series
Ideal for Server, AIOT & Industrial
- Capacity: 1/2/4/8/16GB/32GB
- SODIMM, UDIMM, RDIMM
- Registered, ECC, non-ECC
Mounting Rugged SODIMM
Ideal for Ruggedized
- Capacity: 4/8/16GB
- Generation: DDR4
- Functionality: ECC, non-ECC
Wide Temperature Series
Ruggedized, Industrial & Server
- Capacity: 1/2/4/8/16GB/32GB
- Temp Range(Tc): -40°C~95°C
- Functionality: Registered, ECC, non-ECC
Ultra Temperature Series
Ideal for AIOT and Industrial
- Capacity: 8/16/32GB
- Temp Range(Tc): -40°C~105/125°C
- Functionality: ECC, non-ECC
ECC series
Ideal for AIOT and Industrial
- Capacity: 1/2/4/8/16/24/32/48GB
- Generation: DDR3/DDR4/DDR5
- Functionality: ECC
Non-ECC series
Ideal for AIOT and Industrial
- Capacity: 1/2/4/8/16/24/32/48GB
- Generation: SDRAM/DDR3/ DDR4/DDR5
- Functionality: non-ECC
MRDIMM
AI Server, HPC and Cloud Computing
- Density: up to 128GB
- DDR Generation: DDR5
- DIMM Size: 133.35*31.25mm (same as RDIMM)
CXL Memory Module
High Density Data Center Computing
- Density: 64GB
- Generation: DDR5; Bandwidth: 31.5GB/s
- Form Factor: E3.S 2T
- Interface: PCIe Gen5 x8
LPDDR5X CAMM2
Portable Devices with Ruggedized Needs
- Density: up to 64GB
- Generation: LPDDR5X; Speed: 8533MT/s
- Form Factor: CAMM2
DDR5 CAMM2
Edge Computing, AI Inference System
- Density: up to 48GB
- Generation: DDR5; Speed: 6400MT/s
- Form Factor: CAMM2