A-ECM-TGU

11th Gen Intel® Core™ SoC i7/i5/i3 & Celeron BGA Processor 3.5” Single Board Computer

Anewtech Systems 3.5” SBC Avalue Single Board Computer A-ECM-TGU
  • Bottom Layer Soldered Processor
  • Single 260-pin SO-DIMM DRAM Socket, Max, Up to 32GB DDR4 3200MTs (non-ECC Supported)
  • Four Display, 2 x DP++, 1 x 2CH LVDS, 1 x eDP
  • Expansion Slot, M.2 Key-B, M.2 Key-E, M.2 Key-M
  • Three Gigabit Ethernet, 1 x 2.5GbE, 2 x 1GbE
  • Wide Temperature -20°C ~ 60°C sku supported
  • DC-Input, +12~+24VDC
Datasheet
Product Specification
Anewtech single board computer A-ECM-TGU Avalue Industrial Computer
System Information
ProcessorOnboard 11th Gen. Intel® Core™ SoC i7/i5/i3 & Celeron® BGA Processor
Intel® Core™ i7-1185G7E, i7-1185GRE (up to 4.4GHz, quad-core, 12M Cache, TDP: 28/15/12W)
Intel® Core™ i5-1145G7E, i5-1145GRE (up to 4.1GHz, quad-core, 8M Cache, TDP: 28/15/12W)
Intel® Core™ i3-1115G4E, i3-1115GRE (up to 3.9GHz, dual-core, 6M Cache, TDP: 28/15/12W)
Intel® Celeron® 6305E (up to 1.8GHz, dual-core, 4M Cache, TDP: 15W)
System MemorySingle 260-pin DDR4 SODIMM Socket, Supports Up to 32GB DDR4 3200MTs SDRAM (non ECC only)
I/O ChipsetITE IT8528E
BIOS InformationAMI BIOS, 256Mbit SPI Flash ROM
Watchdog TimerH/W Reset, 1sec. ~ 65535sec and 1sec. or 1min./step
H/W Status MonitorCPU & system temperature monitoring Voltages monitoring
TPMTPM 2.0 (Onboard NuvoTon NPCT754AADYX)
Expansion
Expansion1 x M.2 Key E 2230 support WiFi module (with PCI-e x1 & USB 2.0 Signal)
1 x M.2 Key B 3042/2242 (with PCIe x1, SATA and USB2.0 signal, with 1 x SIM card slot) standard package with 52 to 42 bracket + screw set ; Support 4G, no 5G (no USB3.0 signal).
1 x M.2 Key M support 2260/2242 (with 1 x PCI-e Gen4 x4 signal), standard package with 60 to 42 bracket + screw set
Storage
Storage1 x M.2 (Key-B, 2242)
1 x SATA III
I/O
USB Port4 x USB 3.2 Gen 2x1
4 x USB 2.0
COM Port2 x RS-232/422/485
4 x RS232
SATA1 x SATA III
DIO1 x 2 x 6 pin, pitch 2.00mm connector for GPIO: 8 bits & +3.3S Level
Other3 x LAN
Display
Graphic ChipsetIntel® Tiger Lake UP3 SoC Processor integrated Gen12 graphics
Spec. & ResolutionDP++ Max resolution 4096x2160@60Hz
LVDS Max resolution 1920 x 1080 Dual channel 18/24-bits
eDP1.3 Max resolution 4096x2160@60Hz
Multiple DisplayFour Display
LVDS1 x LVDS: 1920 x 1080 Dual channel 18/24-bits LVDS (Chrontel CH7511B-BFI eDP to LVDS)
Audio
Audio Codec92HD73C Tempo
Audio InterfaceMic-In, Line-In, Line-Out
Audio Amplifier3W Amplifier
Certifications
Certification InformationCE
FCC Class B
Ethernet
LAN ChipsetIntel® I225LM, I210AT for standard temperature
Intel® I225IT, I210IT for wide temperature
Ethernet Interface1 x 10/100/1000/2.5G Base-Tx GbE compatible
2 x 10/100/1000 Base-Tx GbE compatible
LAN Port3 x RJ-45
Mechanical & Environmental
Operating TemperatureStandard Temperature: 0°C ~ 60°C (-4~140°F) with 0.5m/s air flow
Wide Temperature: -20°C ~ 60°C(32~140°F) with 0.5m/s air flow for Wide Temp CPU SKU
Storage Temperature-40°C ~ 85°C (-40°F ~ 185°F)
Operating Humidity40°C @ 95% Relative Humidity, Non-condensing
Weight0.44lbs (0.2kg)
Vibration Test1.5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 30min/Axis, 3 Axis
Shock Test10G, IEC 60068-2-27, Half Sine, 11ms, Z Axis
Drop TestISTA 2A, IEC-60068-2-32 Test : Ed, 1 Corner, 3 Edges, 6 Faces
Power RequirementDC in +12V ~ +24V
ACPISingle power ATX Support S0,S3, S4, S5
ACPI 5.0 Compliant
Power ModeAT/ATX (Default Setting: AT)
Dimension (L x W)5.7" x 4" (146mm x 101mm)
Software Support
OS InformationWin 10
Linux