ARS-111GL-DSHR-LCC

1U 2-Node NVIDIA GH200 Grace Hopper Superchip system with liquid-cooling supporting NVIDIA BlueField-3 or NVIDIA ConnectX-7
Anewtech-Systems-GPU-Server-Supermicro-ARS-111GL-DSHR-LCC

Two nodes in a 1U form factor. Each node supports the following:

  • Supports up to eight E1.S drives with NVIDIA's BlueField®-3 in Storage Configuration  
  • High density 1U 2-node GPU system with Integrated NVIDIA® H100 GPU
  • NVIDIA Grace Hopper™ Superchip (Grace CPU and H100 GPU), up to 72 cores per node (Liquid-Cooled)
  • NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and GPU at 900GB/s
  • Up to 576GB of coherent memory per node including 480GB LPDDR5X (CPU) and 96GB of HBM3 (GPU) for LLM applications
  • 2 PCIe 5.0 x16 slots per node (1 PCIe FHFL slot dedicated to BlueField-3 and 1 PCIe LP)
  • Supports up to eight hot-swap E1.S drives bays (four per node).
  • 7 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control

Key Applications

  • High Performance Computing
  • AI/Deep Learning Training and Inference
  • Large Language Model (LLM) and Generative AI
Anewtech-Systems-GPU-Server-Supermicro-ARS-111GL-DSHR-LCC-Nvidia-liquid-cooled-GPU-Servers.
Anewtech-Systems-GPU-Server-Supermicro-ARS-111GL-DSHR-LCC-Nvidia-liquid-cooled-Servers
Product SKUsARS-111GL-DSHR-LCC
MotherboardSuper G1SMH-G
Processor (per Node)
CPUNVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip
NoteSupports up to 2000W TDP CPUs (Liquid Cooled)​
GPU (per Node)
Max GPU CountUp to 1 onboard GPU
Supported GPUNVIDIA: H100 Tensor Core GPU on GH200 Grace Hopper™ Superchip
GPU-GPU InterconnectPCIe
System Memory (per Node)
MemorySlot Count: Onboard Memory
Max Memory: Up to 480GB ECC LPDDR5X
Additional GPU Memory: Up to 96GB ECC HBM3
On-Board Devices (per Node)
ChipsetSystem on Chip
Input / Output (per Node)
LAN1 RJ45 1 GbE Dedicated BMC LAN port
USB1 port(Rear)
Video1 mini-DP port
System BIOS
BIOS TypeAMI 64MB SPI Flash EEPROM
Management
Power configurationsPower-on mode for AC power recovery
ACPI Power Management
PC Health Monitoring
CPUMonitors for CPU Cores, Chipset Voltages, Memory
FANFans with tachometer monitoring
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
TemperatureMonitoring for CPU and chassis environment
Thermal Control for fan connectors
Chassis
Form Factor1U Rackmount
ModelCSE-MG102TS-R000NDFP-2N
Dimensions and Weight
Height1.7" (43.6 mm)
Width17.26" (438.4 mm)
Depth35.4" (900 mm)
Package9.05" (H) x 27.36" (W) x 46.06" (D)
WeightGross Weight: 49.21 lbs (22.32 kg)
Net Weight: 33.64 lbs (15.26 kg)
Available ColorSilver
Front Panel
ButtonsPower On/Off button
Expansion Slots (per Node)
PCI-Express (PCIe) ConfigurationDefault
1 PCIe 5.0 x16 FHFL slot
1 PCIe 5.0 x16 LP slot
Drive Bays / Storage (per Node)
Drive Bays ConfigurationDefault: Total 4 bays 4 front hot-swap E1.S NVMe drive bays
M.22 M.2 NVMe slots (M-key)
System Cooling
FansUp to 7 Removable heavy-duty 4cm Fan(s)
Liquid CoolingDirect to Chip (D2C) Cold Plate (optional)
Power Supply
Power Supply2x 2700W Redundant Titanium Level (96%) power supplies
Dimension (WxHxL)73.5 x 40 x 185 mm
Input2700W: 200-240Vac / 50-60Hz
2700W: 240-240Vdc / 50-60Hz (for CQC only)
+12VMax: 225A / Min: 0A (200Vac-240Vac)
Max: 225A / Min: 0A (240Vdc-240Vdc)
12V SBMax: 4A / Min: 0A
Output TypeBackplanes (gold finger)
Operating Environment
Environmental Spec.Operating Temperature: 10°C to 35°C (50°F to 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)