SYS-122FT-DEO-LCC

1-OU 2-Node FlexTwin™ with liquid cooling
Anewtech-Systems-Twin-Server-Supermicro-FlexTwin-SuperServer-SYS-122FT-DEO-LCC

Two hot-pluggable systems (nodes) in a 1-OU form factor. Each node supports the following:

  • 21” OCP ORV3 Rack compatible, 1400A busbar with power shelves
  • Dual Intel® Xeon® 6900 Series Processors up to 128 P-cores or Intel Xeon 6+ Processors up to
  • 288 E-cores with Liquid Cooling (Up to 90% heat capture)
  • Up to 24 DIMMs supporting up to 6TB 8000MT/s DDR5 RDIMM or 3TB 8800MT/s DDR5 MRDIMM
  • Flexible networking with up to 1 OCP 3.0 compatible AIOM slots
  • Optional 2 PCIe 5.0 x16 FHHL slot + Optional 1 PCIe 5.0 x16 LP slot
  • Optional 2 E1.S Slots + Optional 2 M.2 NVME drive Slots

Key Applications

  • HPC 
    Web Server 
    Oil & Gas 
    Scientific Research 
    Cloud Computing 
    Research Lab/National Lab
  • Design & Visualization 
    3D Rendering 
    Diagnostic Imaging 
    AI Training
Product SKUsSYS-122FT-DEO-LCC
MotherboardSuper X14DBT-FLAP2
Processor (per Node)
CPUDual Socket BR (LGA-7529) 
Intel® Xeon® 6900 Series processors with P-cores and Intel Xeon 6+ processors
Core CountP-cores: Up to 128C/256T; Up to 504MB Cache per CPU 
E-cores: Up to 288C/288T; Up to 576MB Cache per CPU
NoteSupports up to 500W TDP CPUs (Liquid Cooled)​
System Memory (per Node)
MemorySlot Count: 24 DIMM slots 
Max Memory (1DPC): Up to 3TB 8800MT/s ECC DDR5 MRDIMM (P-core only) 
Max Memory (1DPC): Up to 6TB 6400MT/s ECC DDR5 RDIMM (P-core) 
Max Memory (1DPC): Up to 3TB 8000MT/s ECC DDR5 RDIMM (E-core)
Memory Voltage1.1V
On-Board Devices (per Node)
NVMeNVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required)
Network ConnectivityVia AIOM
Input / Output (per Node)
LAN1 RJ45 1 GbE Dedicated BMC LAN port (ASPEED AST2600)
USB1 USB 3.0 Type-A port(Front)
Video1 Mini-DP port(Front)
System BIOS
BIOS TypeAMI 64MB SPI Flash
Management
SoftwareSuperCloud Composer® (SCC) 
Supermicro Server Manager (SSM) 
Super Diagnostics Offline (SDO) 
Supermicro Thin-Agent Service (TAS) 
SuperServer Automation Assistant (SAA) New!
Power configurationsPower-on mode for AC power recovery 
ACPI Power Management
Security
HardwareTrusted Platform Module (TPM) 2.0 
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
FeaturesCryptographically Signed Firmware 
Secure Boot 
Secure Firmware Updates 
Automatic Firmware Recovery 
Supply Chain Security: Remote Attestation 
Runtime BMC Protections 
System Lockdown
PC Health Monitoring
CPUMonitors for CPU Cores, Chipset Voltages, Memory
FanFans with tachometer monitoring 
Pulse Width Modulated (PWM) fan connectors 
Status monitor for speed control
TemperatureMonitoring for CPU and chassis environment
Chassis
Form Factor1-OU Rackmount
ModelCSE-OC101TS-V01DFP
Dimensions and Weight
Height1.89" (48 mm)
Width21.14" (537 mm)
Depth33.66" (855 mm)
Package7.17" (H) x 26.38" (W) x 44.29" (D)
WeightGross Weight: 89 lbs (40.37 kg) 
Net Weight: 58.5 lbs (26.54 kg)
Available ColorSilver
Front Panel
ButtonsPower On/Off 
UID button
LEDPower status 
UID
Expansion Slots (per Node)
PCI-Express (PCIe) ConfigurationDefault*
1 PCIe 5.0 x16 (in x16) AIOM slot (OCP 3.0 compatible) 
Option A*
2 PCIe 5.0 x16 (in x16) FHHL slots 
1 PCIe 5.0 x16 (in x16) LP slot 
(*Requires additional parts)
M.22 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110(default); Optional Configuration)
Drive Bays / Storage (per Node)
Drive Bays ConfigurationOption A: Total 2 bays 2 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bays 
(*NVMe support may require additional storage controller and/or cables, please see the optional parts list for details)
M.22 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110(default); optional configuration)
System Cooling
FansUp to 8 Fan 40mm Fan(s)
Air Shroud1 Air Shroud
Liquid CoolingDirect to Chip (D2C) Cold Plate
Power SupplyPower via Busbar (49-52V DC)
Operating Environment
RoHSRoHS Compliant
Environmental Spec.Operating Temperature: 10°C to 35°C (50°F to 95°F) 
Non-operating Temperature: -30°C to 60°C (-22°F to 140°F) 
Operating Relative Humidity: 8% to 80% (non-condensing) 
Non-operating Relative Humidity: 8% to 90% (non-condensing)