SYS-211SE-31AS
SuperEdge 2U 3-node UP Server. front I/O short-depth server
Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
- Single Socket E (LGA-4189) 5th/4th Gen Intel® Xeon Scalable processors (per node)
- 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node)
- 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node)
- 2 NVMe M.2 2280/22110 (per node)
- 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node)
- Front-access 2000W AC Redundant Power Supplies (per system)
Product SKUs | SuperServer SYS-211SE-31AS (Silver) |
Motherboard | Super X13SEED-SF |
Processor (per Node) | |
CPU | Single Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors |
Core Count | Up to 52C/104T; Up to 97.5MB Cache per CPU |
Note | Supports 85W - 300W TDP CPUs (Air Cooled)* *Air Cooled CPUs with TDP over 205W only supported under specific conditions. |
System Memory (per Node) | |
Memory | Slot Count: 8 DIMM slots/1 Channels Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM |
Memory Voltage | 1.1 V |
On-Board Devices (per Node) | |
Chipset | Intel® C741 |
Network Connectivity | 1x 1GbE SFP |
IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
Input / Output (per Node) | |
LAN | 1 SFP GbE LAN port (Shared NIC |
Video | 1 VGA port(s) |
Serial Port | 1 COM Port(s) (1 COM) |
Others | 1 KVM dongle (output VGA x1, COM x1, USB 2.0 x2 through KVM cable) |
Management | |
Software | SuperDoctor® 5 IPMI 2.0 |
Power Configurations | ACPI Power Management Power-on mode for AC power recovery |
PC Health Monitoring | |
CPU | Monitors for CPU Cores, Chipset Voltages, Memory |
FAN | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
Temperature | CPU thermal trip support, PEPI Monitoring for CPU and chassis environment |
Chassis | |
Form Factor | 2U Rackmount |
Model | CSE-SE201-R2K07P |
Note | 16.9” (430mm) chassis depth Front access IO design, and tool less serviceability Three front hot-swappable nodes with single CPU socket and 8 DIMM design |
Dimensions and Weight | |
Height | 3.5" (88mm) |
Width | 17.7" (449mm) |
Depth | 16.9" (430mm) |
Package | 9.5" (H) x 29.5" (W) x 23.2" (D) |
Weight | Net Weight: 55.1 lbs (25 kg) Gross Weight: 70.6 lbs (32 kg) |
Available Color | Silver |
Front Panel | |
Buttons | Power On/Off UID button |
LEDs | LAN1 activity Power status System information |
Expansion Slots (per Node) | |
PCI-Express (PCIe) | 1 PCIe 5.0 x16 LP slot(s) 2 PCIe 5.0 x16 FHHL slot(s) |
Drive Bays / Storage (per Node) | |
Drive Bays | N/A |
M.2 | 2 M.2 NVMe M-Key, 2280/22110 |
System Cooling | |
Air Shroud | 3 Air Shroud(s) |
Fans | 12x 8cm heavy duty fans with optimal fan speed control 40x56mm Fan(s) |
Power Supply | 2000W Redundant AC 100-240V Power Supply |
Dimension (W x H x L) | 73.5 x 40 x 265 mm |
AC Input | 1000W: 100-127Vac / 9A-12A / 50-60Hz 1800W: 200-220Vac / 9.8A-10A / 50-60Hz 2000W: 220-240Vac / 10A-11A / 50-60Hz |
+12V | Max: 83A / Min: 0A (100Vac-127Vac) Max: 150A / Min: 0A (200Vac-220Vac) Max: 166A / Min: 0A (220Vac-240Vac) |
Operating Environment | |
Environmental Spec. | Operating Temperature: 0°C ~ 35°C (32°F ~ 95°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
Note | Operating Temperature (CPU TDP up to 300W) : Continuous0°C to 35°C (32°F to 95°F) Operating Temperature(CPU TDP up to 205W): Continuous 0°C ~ 35°C (32°F ~ 95°F), Short term -5°C ~ 55°C (23°F ~ 131°F) |
SuperEdge: High-Density Computing and Flexibility at the Intelligent Edge
SuperEdge features an integrated, all-in-one Commercial Off The Shelf (COTS) server design optimized for CU/ DU deployments in Open vRAN networks. handle immense traffic volumes at remote locations.
With NCSI support, operators can use a single fiber connection for both data traffic and OOB management, and the integrated architecture of the 5G RAN system eliminates the need for add-on cards and breakout cables, resulting in a system that is optimized for cost, size and power usage and is able to handle immense traffic volumes at remote locations.
Short-depth 3-node with redundant AC/DC power supply
Compact yet versatile system designed for maximum performance at the Edge
- 2U Short-depth (430mm), 3-node system
- Single 5th/4th Gen Intel® Xeon® Scalable processor per node
- Front-access hot-swappable nodes
- Up to 8 DIMMs slots per node supporting DDR5-5600
- Up to 3 PCIe 5.0 slots per node
- Operating temperatures from -5ºC to 55ºC (CPU TDPdependent)
- RJ45 or SFP management port options
SYS-211SE-31A / SYS-211SE-31AS
Short-depth 3-node,
redundant AC power
RJ45 or SFP management port options
SYS-211SE-31D / SYS-211SE-31DS
Short-depth 3-node,
redundant DC power
RJ45 or SFP management port options
Resources:
Supermicro Accelerating Adoption of Edge AI
Edge AI has emerged as a critical concept, particularly in industries where real-time data processing is paramount.
5G, Edge, and IoT/Embedded Servers
Supermicro Building Block solutions for 5G networks, the intelligent edge, and embedded applications