SYS-222HE-FTN
X14 DP 2U short-depth front I/O system with 6 hot-swap 2.5" NVMe/SAS/SATA bays and 4 PCIe 5.0 x16 slots + 2 PCIe 5.0 x16 AIOM slots
- Dual Intel® Xeon® 6 6700 series processors with E-cores
- 32 DIMM slots supporting up to 2TB of memory
- Optional PCIe slot configurations up to 8 PCIe 5.0 x8 (6FHFL + 2 FHHL) or 4 PCIe 5.0 x16 (3 FHFL + 1 FHHL) slots with support for double-width GPU/Accelerator cards
- Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible)
- 6 Rear hot-swap 2.5" NVMe/SAS/SATA drive bays with optional configurations for additional 2 or 4 front hot-swap 2.5"
- NVMe drive bays (space share with PCIe slots); 2x internal M.2 NVMe drive slots; Optional RAID support via storage add-on card
Key Applications
- Virtualization
- Software-defined Storage
- 5G Core and Edge
- AI Inference and Machine Learning
- Cloud Computing
- Enterprise Server
Datasheet
Product Specification
| Product SKU | SuperServer SYS-222HE-FTN |
| Motherboard | Super X14DBM-SP |
| Processor | |
| CPU | Dual Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with E-cores |
| Core Count | Up to 144C/144T; Up to 108MB Cache per CPU |
| Note | Supports up to 330W TDP CPUs (Air Cooled) Supports up to 330W TDP CPUs (Liquid Cooled) |
| GPU | |
| Max GPU Count | Up to 3 double-width or 4 single-width GPU(s) |
| CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect |
| GPU-GPU Interconnect | PCIe |
| System Memory | |
| Memory | Slot Count: 32 DIMM slots/16 Channels Max Memory (1DPC): Up to 2 TB 6400MT/s ECC DDR5 RDIMM Max Memory (2DPC): Up to 2 TB 5200MT/s ECC DDR5 RDIMM |
| On-Board Devices | |
| NVMe | NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required) |
| Chipset | System on Chip |
| Network Connectivity | Via AIOM |
| Input / Output | |
| LAN | 1 RJ45 1 GbE Dedicated BMC LAN port(s) |
| USB | 2 USB 3.0 port(s) (front) |
| Video | 1 VGA port(s) |
| System BIOS | |
| BIOS Type | AMI 64MB SPI Flash |
| Management | |
| Software | SuperCloud Composer Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) |
| Power configurations | Power-on mode for AC power recovery ACPI Power Management |
| Security | |
| Hardware | Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
| Features | Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown |
| PC Health Monitoring | |
| CPU | Monitors for CPU Cores, Chipset Voltages, Memory |
| FAN | Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors |
| Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Chassis | |
| Form Factor | 2U Rackmount |
| Model | CSE-HE211-R000NFP |
| Dimensions and Weight | |
| Height | 3.5" (88.9 mm) |
| Width | 17.2" (436.88 mm) |
| Depth | 22.6" (574 mm) |
| Package | 9.7" (H) x 23.5" (W) x 36.9" (D) |
| Weight | Gross Weight: 47.4 lbs (21.5 kg) Net Weight: 34.4 lbs (15.6 kg) |
| Available Color | Silver |
| Front Panel | |
| LED | HDD activity LED LAN1 activity LAN2 activity Power Fail Power status LED System information |
| Buttons | Power On/Off UID button |
| Expansion Slots | |
| PCI-Express (PCIe) Configuration | Option A* 3 PCIe 5.0 x16 FH/10.5"L double-width slot(s) 1 PCIe 5.0 x16 FHHL slot(s) 2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible) Option B* 6 PCIe 5.0 x8 (in x16) FH/10.5"L slot(s) 2 PCIe 5.0 x8 (in x16) FHHL slot(s) 2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible) (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options ) |
| CXL Support | Up to 4 CXL 2.0 x16/x8 devices |
| M.2 | 2 M.2 PCIe 5.0 x2 NVMe slot(s) (M-key 2280/22110) |
| Drive Bays / Storage | |
| Drive Bays Configuration | Default: Total 6 bay(s) 6 rear hot-swap 2.5" NVMe*/SAS*/SATA* drive bay(s) Option A: Total 8 bay(s) 6 rear hot-swap 2.5" NVMe*/SAS*/SATA* drive bay(s) 2 front hot-swap 2.5" NVMe* drive bay(s) Option B: Total 10 bay(s) 6 rear hot-swap 2.5" NVMe*/SAS*/SATA* drive bay(s) 4 front hot-swap 2.5" NVMe* drive bay(s) (*NVMe/SAS/SATA support may require additional storage controller and/or cables) |
| M.2 | 2 M.2 PCIe 5.0 x2 NVMe slot(s) (M-key 2280/22110/25110) |
| System Cooling | |
| Fans | 6 counter-rotating 60x60x56mm Fan(s) |
| Liquid Cooling | Direct to Chip (D2C) Cold Plate (optional) |
| Power Supply | 2x 2000W Redundant (1 + 1) Titanium (certification pending) Level (96%) Hot-plug power supplies 2x 1200W power supplies 2x 1300W Redundant (1 + 1) power supplies |
| Operating Environment | |
| Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
Best-in-class Performance and Flexibility for Edge Data Centers
X14 Hyper-E
Flagship performance in a short-depth form factor
- Short-depth form factor (574mm/22.6“) for space constrained environments
- Dual socket architecture featuring Intel® Xeon® 6700 series processors with E-cores
- Enhanced serviceability in the field with front I/O
- Up to 3 PCIe 5.0 x16 double-width or 6 PCIe 5.0 x16 single width slots
- AC and DC power supply options
X14 Hyper-E: Maximum Performance and Flexibility for Edge Data Centers
Hyper-E delivers the performance and flexibility of Supermicro’s flagship rackmount server family in a compact form factor optimized for telco and micro data center deployments. A mid-depth chassis and front I/O makes it easier to incorporate Hyper-E into existing edge and telco infrastructure, while carrier grade (NEBS Level 3) design and optional DC power options further enhance flexibility in non-traditional data center environments.
Storage and expansion configurations can be adjusted depending on the application, while maintenance-friendly design innovations eliminate the need for tools when servicing the system to simplify rollout and installation.
- Dual Intel® Xeon® 6700 series processors with E-cores
- High-density processing power in compact form factors suitable for Edge deployments
- Support for DDR5-6400 with up to 32 DIMMs
- Flexible I/O with up to 2 AIOM PCIe 5.0 and 8 PCIe 5.0 slots
- Both AC and DC power configurations available with redundant power supplies
- Enhanced operating temperatures from -5ºC to 55ºC (CPU TDP-dependent)
- Front or rear I/O configurations available
2U DP Hyper-E
SYS-222HE-TN
Rear I/O
2U DP Hyper-E
SYS-222HE-FTN
Front I/O
Resources:
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