SYS-222GS-NB3OT-ALC
DP Intel 2-OU (OCP ORV3) Liquid-Cooled System with NVIDIA HGX B300 8-GPU
- 21” OCP ORV3 Rack compatible, 1400A busbar with power shelves, DC-SCM Support
- Dual Intel® Xeon® 6700 series processors with P-cores, up to 350W TDP
- NVIDIA HGX B300 8-GPU with 5th Generation NVLink® 1.8TB/s, 2.3TB of HBM3e GPU memory per system
- 8x NVIDIA ConnectX®-8 SuperNICs, up to 800Gb/s, up to two NICs for North/South traffic
- 32x DIMMs with up to 8TB at 5200MT/s or up to 4TB at 6400MT/s DDR5 RDIMM
- 8x Hot-swap E1.S NVMe storage drive bays and 2x M.2 NVMe boot drives
- 2x 10GbE RJ45 via AIOM card
Key Applications
- Artificial Intelligence (AI)
- HPC
- AI/Deep Learning Training
- Deep Learning Inferencing
- LLMs & Multi-modal LLMs
Datasheet
Product Specification
| Product SKU | SuperServer SYS-222GS-NB3OT-ALC |
| Motherboard | Super X14DBG-LC2 |
| Processor | |
| CPU | Dual Socket E2 (LGA-4710) Intel® Xeon® 6700-series processors with P-cores |
| Core Count | Up to 86C/172T; Up to 335MB Cache per CPU |
| Note | Supports up to 350W TDP CPUs (Liquid Cooled) |
| GPU | |
| Max GPU Count | 8 onboard GPUs |
| Supported GPU | NVIDIA SXM: HGX B300 8-GPU (288GB) |
| CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect |
| GPU-GPU Interconnect | NVIDIA® NVLink® with NVSwitch™ |
| System Memory | |
| Memory | Slot Count: 32 DIMM slots Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM Max Memory (2DPC): Up to 8TB 5200MT/s ECC DDR5 RDIMM |
| Memory Voltage | 1.1V |
| On-Board Devices | |
| Chipset | System on Chip |
| Input / Output | |
| LAN | 2 RJ45 10 GbE LAN ports (Intel® X710) 8 OSFP 800 Gb/s InfiniBand LAN ports (NVIDIA ConnectX®-8 SuperNIC) 1 RJ45 1 GbE Dedicated BMC LAN port (ASPEED AST2600) (via DC-SCM) |
| Video | 1 VGA port(Front) 1 Mini-DP port(Front) |
| TPM | 1 TPM header |
| System BIOS | |
| BIOS Type | AMI 64MB UEFI |
| Management | |
| Software | SuperCloud Composer® Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New! |
| Power configurations | Power-on mode for AC power recovery ACPI Power Management |
| Security | |
| Hardware | Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
| Features | Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown |
| PC Health Monitoring | |
| CPU | Monitors for CPU Cores, Chipset Voltages, Memory |
| FAN | Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors |
| Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Chassis | |
| Form Factor | 2-OU Rackmount |
| Model | CSE-GP202TS-000NP |
| Dimensions and Weight | |
| Height | 3.7" (94 mm) |
| Width | 21.1" (537 mm) |
| Depth | 31.69" (805 mm) |
| Package | 13.15" (H) x 29.5" (W) x 51.18" (D) |
| Weight | Gross Weight: 187 lbs (85 kg) Net Weight: 165 lbs (75 kg) |
| Available Color | Silver |
| Front Panel | |
| LED | Network activity LEDs UID |
| Buttons | Power On/Off |
| Expansion Slots | |
| PCI-Express (PCIe) Configuration | Default 2 PCIe 5.0 x16 (in x16) FHHL slots |
| Drive Bays / Storage | |
| Drive Bays Configuration | Default: Total 8 bays 8 front hot-swap E1.S NVMe drive bays |
| M.2 | 2 M.2 NVMe slots (M-key; RAID support via S3808N controller) |
| System Cooling | |
| Fans | Up to 4 Fan 80mm Fan(s) Up to 4 Fan 40mm Fan(s) |
| Air Shroud | 3 Air Shrouds |
| Liquid Cooling | Direct to Chip (D2C) Cold Plate |
| Power Supply | Power via Busbar (48-52V DC) |
| Operating Environment | |
| Environmental Spec. | Operating Temperature: 10°C to 35°C (50°F to 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
2-OU (OCP) Liquid-Cooled HGX B300 Server: Hyperscale Performance in Ultra-Compact Design
Built to the 21-inch OCP Open Rack V3 (ORV3) specification, Supermicro’s 2-OU liquid-cooled NVIDIA HGX B300 system sets a new standard for GPU density and efficiency. Each compact node features eight NVIDIA Blackwell B300 GPUs operating at up to 1,100W TDP, cooled by state-of-the-art liquid cooling with blind-mate manifold connections and modular GPU/CPU tray architecture.
This innovative design delivers exceptional serviceability while dramatically reducing power consumption and rack footprint—enabling hyperscale and cloud providers to maximize compute performance in space-constrained data centers.
2-OU 8-GPU System: SYS-222GS-NB3OT-ALC
| Overview | 2-OU liquid-cooled system with front I/O NICs, DPUs, storage, and management |
|---|---|
| CPU | Dual Intel® Xeon® 6700 series processors with P-cores |
| Memory | 32 DIMMs, up to 8TB DDR5-5200 or up to 4TB DDR5-6400 |
| GPU | NVIDIA HGX B300 8-GPU (288GB HBM3e per GPU*) 1.8TB/s NVLink GPU-GPU interconnect with NVSwitch |
| NVLink | 5th Generation NVIDIA NVLink at 1.8TB/s |
| Networking | 8 integrated NVIDIA ConnectX®-8 SuperNICs, up to 800Gb/s 2 dual-port NVIDIA BlueField®-3 DPUs |
| Storage | 8 front hot-swap E1.S NVMe drive bays 2 M.2 NVMe slots |
| Power Supply | Shared power through 4+4 rack power shelves with ORV3 busbar design |
